Flip-chip die bonder FINEPLACER® femto pro

epoxyeutecticmulti-chip

Automatic Multi-Purpose Bonder The automated FINEPLACER® femto pro embodies the essence of the successful FINEPLACER® femto die bonder platform, offering high precision and versatility with a focus on reduced cost-per-bond and higher UPH. With specifications such as a placement accuracy of 2.0 µm @ 3 Sigma and ultra-low to high bonding force capability, this model is perfectly suited to dynamic assembly of photonics, power electronics and sensors. Designed for high-yield production tasks, the FINEPLACER® femto pro supports a wide spectrum of advanced die attach technologies, including laser- assisted bonding, ultrasonic bonding, adhesive bonding, thermo-compression as well as eutectic and reactive soldering. Its complete machine enclosure ensures a stable process environment while protecting operators from gas, vapor, and UV radiation. Equipped with IPM Command software, the FINEPLACER® femto pro provides an intuitive and structured interface for process development and safe production flow. The software enables synchronized control of all process parameters and additional modules, offering automated pattern recognition for precise substrate and component alignment. Thanks to its modular and highly customizable design, the FINEPLACER® femto pro can be configured and upgraded in-field to meet evolving demands, making it a cost-effective and future-proof solution for the rapidly advancing assembly industry.