Multi-chip for flip chip die bonder FineXT 6003

automatedhigh-accuracy

Large-Area Multi-Chip Production Die Bonder The all new FineXT 6003 is a fully automatic large area production die bonder with true multi-chip, multi placement capability for high volume manufacturing. The modular design allows to configure this production die bonder for multiple advanced packaging technologies. The machine’s capabilities can be easily enhanced to adapt to new technological trends in semiconductor manufacturing. Combined with an automatic material handling and tool management system, this ensures the production die bonder’s high degree of process flexibility for next-generation optoelectronic and demanding fan-out applications. In operation, a speed mode and a precision mode can be flexibly combined. Given the frequently changing precision requirements during the assembly of multi-chip modules, this capability ensures optimal throughput and makes the production die bonder FineXT 6003 the perfect solution for modern semiconductor manufacturing environments. Placement accuracy of 3 µm Very large bond area for wafers and panels Multi wafer capability Automatic placement accuracy calibration Fully automatic material management Automatic tool management Adjustable Speed for Production Multi-chip capability Granite base and air bearings Wide range of component presentation (wafer, waffle pack, gel-pak®) Modular machine platform allows in-field retrofitting during entire service life Synchronized control of all process related parameters Numerous bonding technologies (adhesive, soldering, thermocompression) Various bonding technologies in one recipe Integrated scrubbing function Individual configurations with process modules