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Micro Assembly

eutectic die bonder

eutectic die bonder FiNEXT P3

ultrasonic epoxy automated

sub-micron die bonder

sub-micron die bonder FINEPLACER® femto 2

automated fully-automatic for micro assembly

flip-chip die bonder

flip-chip die bonder FINEPLACER® femto pro

epoxy eutectic multi-chip

manual die bonder

manual die bonder FINEPLACER® pico 2

for micro assembly communications sector for medical applications

flip-chip die bonder

flip-chip die bonder FINEPLACER® lambda 2

sub-micron automated for micro assembly

sub-micron die bonder

sub-micron die bonder FINEPLACER® sigma

semi-automatic for micro assembly communications sector

multi-chip die bonder

multi-chip die bonder FineXT 6003

automated for micro assembly communications sector

Advanced Rework

hot air rework station

hot air rework station FINEPLACER® core plus

for BGA for SMD for LCDs

hot air rework station

hot air rework station FINEPLACER® pico rs

automatic for BGA for SMD

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