Research and development die bonders

Placement accuracy: 3 µm

... Multi-Purpose Manual Die Bonder The FINEPLACER® pico 2 is a versatile manual die bonder with placement accuracy down to 3 µm. Quick to set up and easy to operate, it is ideal for ...

Placement accuracy: 0.5 µm

... table top flip chip bonder FINEPLACER® lambda 2 builds on its acclaimed predecessor to set new standards in precision die attach and advanced chip packaging for opto-electronic assemblies and more. The completely revised ...

Placement accuracy: 3 µm - 7 µm

... H3-DB20HF is a fully automatic pre-sintering placement equipment designed for R& D testing and mass production of SiC modules. The machine features a modular design with standard flow lines that can be connected in series and can be customized ...

Placement accuracy: 3 µm - 7 µm

... is a high-precision automatic silver-adhesive placement system developed for advanced packaging processes, intended for COB R& D verification and mass production. The unit features a modular architecture and supports automatic dispensing, ...

Placement accuracy: 1 µm - 5 µm

... processes. It is designed for COC and COS eutectic workflows and features an automatic tool change system, making it suitable for R& D and industrial mass production.

Key features

• Fully automatic placement workflow
• High

Placement accuracy: 1 µm - 3 µm

... energy vehicles, suitable for both R& D and industrial volume production.

Key attributes

• Automated operation
• Precision placement (±1 μm on standard substrates)
• High flexibility for R&D

Placement accuracy: 3 µm - 7 µm

... advanced packaging that supports eutectic soldering and silver-adhesive (epoxy) dispensing. It is engineered for production and R& D scenarios requiring multichip handling, automatic tool exchange and precision placement.

Highlights