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Placement accuracy: 3 µm - 3 µm
... maximizing uptime.
Placement accuracy: 0.5 µm
... table top flip chip bonder FINEPLACER® lambda 2 builds on its acclaimed predecessor to set new standards in precision die attach and advanced chip packaging for opto-electronic assemblies and more. The completely revised ...
Placement accuracy: 0.5 µm
... Semi-automated Sub-Micron Bonder The FINEPLACER® sigma combines sub-micron placement accuracy with a 450 x 150 mm working area and bonding forces up to 1000 N. The system is ideal for all types of precision die bonding ...
Placement accuracy: 5 µm - 5 µm
... 0.5° @ 3σ
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