{{product.productLabel}} {{product.model}}
{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
{{product.productLabel}} {{product.model}}
{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
Placement accuracy: 1 µm
... li>
Key Features
- High‑precision
ASM Assembly Systems
... Product overview
ASMPT AD838L-G2 Automatic
Die
Bonder for precision
die placement and bonding in semiconductor and advanced packaging production. The system supports flip chip handling and extra-large ...
ASM Assembly Systems
Placement accuracy: 2 µm
... Overview
Flexible, precision multi-chip
die
bonder designed for large-substrate handling and 12″ wafer input, intended for automated assembly of multi-chip packages with tight placement and bond-line requirements.
Key ...
ASM Assembly Systems
Placement accuracy: 5 µm - 5 µm
... 0.5° @ 3σ
Placement accuracy: 3 µm - 3 µm
... maximizing uptime.
Finetech
Placement accuracy: 0.5 µm
... table top flip chip bonder FINEPLACER® lambda 2 builds on its acclaimed predecessor to set new standards in precision die attach and advanced chip packaging for opto-electronic assemblies and more. The completely revised ...
Finetech
Placement accuracy: 0.5 µm
... Semi-automated Sub-Micron Bonder The FINEPLACER® sigma combines sub-micron placement accuracy with a 450 x 150 mm working area and bonding forces up to 1000 N. The system is ideal for all types of precision die bonding ...
Finetech
the best suppliers