Die-attach die bonder MEGA

multi-chipautomatedMEMS

Overview
Flexible, precision multi-chip die bonder designed for large-substrate handling and 12″ wafer input, intended for automated assembly of multi-chip packages with tight placement and bond-line requirements.

Key features

• Patented look-through pattern recognition technology for accurate alignment
• High-precision placement
  • XY placement: ± 2 µm @ 3σ
  • Die rotation: ± 0.1° @ 3σ
• Large substrate handling: max 280 mm × 300 mm
• Supports 12″ wafer input
• Advanced bond-line thickness (BLT) control
• Multi-chip bonding capability
  • Auto bond-tool change with up to 10 bond-tool buffers and 5 ejector tools
  • Modular options to address diverse multi-chip package requirements

* All performance is package and material dependent

Technical specifications

• Model name: MEGA
• Placement accuracy (XY): ± 2 µm @ 3σ
• Die rotation accuracy: ± 0.1° @ 3σ
• Maximum substrate size: 280 mm × 300 mm
• Wafer handling: supports 12″ wafer input
• Bond line control: Advanced BLT control
• Multi-chip support: auto bond-tool change with up to 10 bond-tool buffers and 5 ejector tools
• Vision: patented look-through pattern recognition technology

Applications

• Multi-chip packaging and heterogeneous integration
• Sensor and MEMS module assembly
• Automotive, industrial and consumer electronics components

Options & integration

• Custom bond-tool configurations and buffers
• Factory automation interface and process monitoring options