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Die-attach die bonder AD838L-Plus
automatedfor the semiconductor industryfor wafers

Die-attach die bonder - AD838L-Plus - ASM Assembly Systems - automated / for the semiconductor industry / for wafers
Die-attach die bonder - AD838L-Plus - ASM Assembly Systems - automated / for the semiconductor industry / for wafers
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Characteristics

Technology
for die-attach
Operational mode
automated
Applications
for the semiconductor industry, for wafers
Other characteristics
high-accuracy, large-area
Placement accuracy

15 µm

Description

Overview
Automatic die bonder designed for large-substrate handling and high throughput.

Features
  • AD838L Series exclusive material handling capability with dragging-free indexing
  • Advanced bond head design with patented technology to support high UPH
  • Supports extra-large substrates up to 300 mm x 100 mm
  • High precision bonding (option)
    • Achieves ±15 µm @ 3σ XY placement accuracy*
    • Patented technology without UPH trade-off
  • Factory automation ready
    • Automatic material handling system
    • Automatic wafer loader (option)

Notes
*All performance is package and material dependent

Technical specifications
  • Model: AD838L-Plus
  • Product type: Automatic Die Bonder
  • Series: AD838L Series
  • Material handling: Dragging-free indexing
  • Maximum substrate size supported: up to 300 mm x 100 mm
  • High precision placement (option): ±15 µm @ 3σ XY placement accuracy*
  • Bond head: Advanced bond head design; patented technology
  • Automation options: Automatic material handling system; Automatic wafer loader (option)
  • Performance note: All performance is package and material dependent

Catalogs

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LED / Photonics

*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.