- Production Machines
- Machine for the electronics industry
- Flip-chip die bonder
- ASM Assembly Systems
Flip-chip die bonder AD280Plusautomatedfor the semiconductor industryfor wafers
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Characteristics
- Technology
- flip-chip
- Operational mode
- automated
- Applications
- for the semiconductor industry, for wafers
- Other characteristics
- high-accuracy
- Placement accuracy
3 µm
Description
Product overview
AD280Plus, an Automatic High Precision Die Bonder that achieves ± 3 µm @ 3σ XY placement accuracy with patented pattern recognition. It provides flip chip handling and broad material compatibility including wafer, waffle pack, Gel-Pak, tray, tape feeder, or custom options. The system enhances traceability with optional barcode, 2D code or OCR technology for substrate, wafer and die identification. AD280Plus is positioned for precise placement, versatile material handling and traceability in die bonding applications.
Features
Technical specifications
AD280Plus, an Automatic High Precision Die Bonder that achieves ± 3 µm @ 3σ XY placement accuracy with patented pattern recognition. It provides flip chip handling and broad material compatibility including wafer, waffle pack, Gel-Pak, tray, tape feeder, or custom options. The system enhances traceability with optional barcode, 2D code or OCR technology for substrate, wafer and die identification. AD280Plus is positioned for precise placement, versatile material handling and traceability in die bonding applications.
Features
- Achieving ± 3 µm* @ 3σ XY placement with patented look-through pattern recognition
- Flip chip handling capability
- Diverse material handling
- Standard: Wafer on expander or clamp ring
- Optional: Waffle pack, Gel-Pak, tray, tape feeder or by request
- Enhancing traceability by barcode, 2D code or OCR on substrate / wafer / die (Option)
Technical specifications
- Type: Automatic High Precision Die Bonder
- Placement accuracy: ± 3 µm @ 3σ (performance package and material dependent)
- Pattern recognition: Patented look-through pattern recognition
- Handling capability: Flip chip handling
- Material compatibility: Wafer (on expander or clamp ring), waffle pack, Gel-Pak, tray, tape feeder, or custom handling options
- Traceability options: Barcode, 2D code, OCR (optional)
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LED / Photonics
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.