Die-attach die bonder Photon Pro

multi-chipfully-automaticfor the semiconductor industry

Product overview
Photon Pro is an automatic high-precision die bonder equipped with patented look-through pattern recognition technology for accurate die placement. It supports large substrates up to 200 mm × 215 mm and integrates OCR for material traceability. The system offers multi-chip bonding, automatic bond-tool change with up to 10 bond-tool buffers, and automatic wafer handling with a 2-stage ejector to streamline production flow.

Applications

• Suitable for optical transceivers and sensor packages such as TOSA, ROSA, Mechanical Optical Interface (MOI), 3D sensors and inertial sensors

Features

• Patented look-through pattern recognition technology
• High precision bonding
  • XY placement accuracy: ± 3 µm @ 3σ*
  • Die rotation accuracy: ± 0.1° @ 3σ*
• Large substrate handling: up to 200 mm × 215 mm
• Material traceability via OCR
• Multi-chip bonding capability
  • Auto bond-tool change with up to 10 bond-tool buffers
  • Auto wafer change: supports up to 6 × 6 in OD Foton Ring with 2-stage ejector system
  • Modular options to meet diverse multi-chip package requirements

Technical specifications

• XY placement accuracy: ± 3 µm @ 3σ*
• Die rotation accuracy: ± 0.1° @ 3σ*
• Maximum substrate size: 200 mm × 215 mm
• Material traceability: OCR (Optical Character Recognition)
• Multi-chip bonding capability
• Auto bond-tool change: up to 10 bond-tool buffers
• Auto wafer change: supports up to 6 × 6 in OD Foton Ring with 2-stage ejector system
• Patented look-through pattern recognition technology
• Modular configuration options for varied multi-chip packages
• Note: All performance is package- and material-dependent