Die-attach die bonder AD830 Plus

automatedfor micro assemblyfor the semiconductor industry

Overview
Automatic die bonder designed for high-throughput semiconductor and microassembly bonding operations. The AD830 Plus by ASMPT integrates advanced mechanical and optical systems to optimize cycle time and maintain simple operation and maintenance.

Features

• High Throughput
  • High speed bonding: up to 22,000* UPH
  • Implementing patented design
    • Double decoupled linear motor bond head system
  • Enhanced dual stamping / dot dispensing speed by latest actuating control system
  • Further improving bonding speed with rotary collet bond arm system
    • Providing automatic theta collection during pick & place process
• Fast Conversion Time by
  • New stamping arm design
  • Magnetic anvil block design
• Latest ASMPT Developed PR System
  • Static bond optic system without motor used
  • Simpler operation and easy maintenance
  • Reducing time for a bonding cycle
    • Taking pre-bond and post-bond inspection at the same time

Notes
* All performance is package and material dependent

Technical specifications

• Product type: Automatic die bonder
• Model: AD830 Plus
• Manufacturer / Brand: ASMPT
• High speed bonding capacity: up to 22,000* UPH (package and material dependent)
• Bond head: Double decoupled linear motor bond head system
• Stamping & dispensing: Enhanced dual stamping / dot dispensing with latest actuating control
• Bond arm: Rotary collet bond arm system with automatic theta collection during pick & place
• Conversion features: New stamping arm design and magnetic anvil block for fast conversion
• PR system: Static bond optic system (no motor), enabling simultaneous pre-bond and post-bond inspection
• Operation: Designed for simpler operation and easy maintenance