- Production Machines
- Machine for the electronics industry
- Automatic wire bonder
- ASM Assembly Systems
High-speed wire bonder AeroLEDautomatic
Add to favorites
Compare this product
Characteristics
- Options
- automatic, high-speed
Description
Product description
AeroLED is an automatic wire bonder engineered for LED assembly. It delivers high-throughput bonding with precise ball formation and repeatable bond placement, suitable for integration into controlled production lines and high-reliability manufacturing environments.
Features
Technical specifications
AeroLED is an automatic wire bonder engineered for LED assembly. It delivers high-throughput bonding with precise ball formation and repeatable bond placement, suitable for integration into controlled production lines and high-reliability manufacturing environments.
Features
- High-speed wire bonding: 24 wires/sec (for 2 mm loop)
- 35 µm bonded ball size
- Dual-directional transducer for consistent energy delivery
- Stable-state XY table for precise motion control
- Precision-controlled wire clamp gap for reproducible bonds
- All-material FAB-controlled enclosure for clean production handling
- Nano-driver electronics solution for fine process control
Technical specifications
- Application: LED wire bonding
- Bonding speed: 24 wires/sec (for 2 mm)
- Bonded ball size: 35 µm
- Transducer: Dual-directional
- Motion system: Stable-state XY table
- Wire handling: Precision-controlled clamp gap
- Material handling: FAB-controlled enclosure for all materials
- Electronics: Nano-driver solution
- Intended use: Integration into LED component production lines, including aerospace-grade lighting assemblies
Catalogs
No catalogs are available for this product.
See all of ASM Assembly Systems‘s catalogsOther ASM Assembly Systems products
LED / Photonics
Related Searches
- Pick-and-place system
- SMT pick-and-place system
- Wafer bonder
- Automatic pick-and-place system
- Automated wafer bonder
- High-accuracy die bonder
- Flip-chip die bonder
- High-speed pick-and-place system
- Die-attach die bonder
- Fully-automatic die bonder
- Micro assembly die bonder
- Epoxy die bonder
- Modular pick-and-place system
- Eutectic die bonder
- Wedge bonder
- Compact pick-and-place system
- Multi-chip die bonder
- Automatic wire bonder
- Wafer die bonder
- Configurable die bonder
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.