Eutectic die bonder AD211Plus-II

for die-attachthermalautomated

Overview
Heated collet eutectic die bonder designed for precise die placement and controlled eutectic bonding with integrated heated collet and H2 forming gas handling.

Features

• Excellent void control
  • Patented heated collet technology
  • H2 forming gas handling
  • Auto tip-tilt alignment (Option)
• High precision eutectic bonding
  • XY placement: ± 7 µm @ 3σ*
  • Die rotation: ± 1° @ 3σ* (Die size > 0.5 mm)
• Enhances package reliability and yield
  • Optional smart heating system with anti-baking thermal management
  • Accurate heated collet temperature health check (Option)

Notes
*All performance is package and material dependent

Technical specifications

• Product type: Heated Collet Eutectic Die Bonder
• Patented heated collet technology
• H2 forming gas handling
• Auto tip-tilt alignment (Option)
• XY placement accuracy: ± 7 µm @ 3σ*
• Die rotation accuracy: ± 1° @ 3σ* (for die size > 0.5 mm)
• Optional smart heating system with anti-baking thermal management
• Accurate heated collet temperature health check (Option)