Flip-chip die bonder FINEPLACER® lambda 2

sub-micronautomatedfor micro assembly

The all-new table top flip chip bonder FINEPLACER® lambda 2 builds on its acclaimed predecessor to set new standards in precision die attach and advanced chip packaging for opto-electronic assemblies and more. The completely revised table top die bonding platform can be easily configured for a wide range of applications for process development or prototyping. Numerous process module options and in-field-retrofit capabilities guarantee maximum technological flexibility of the table top die bonder to protect your investment in the face of ever-changing challenges. Due to the table top flip chip bonder’s ergonomic machine design and software-supported user guidance, the user remains at the center of action. Powerful optical systems allow the user to keep an overview at all times, even when working in the sub-micron range. The table top die bonder FINEPLACER® lambda 2 shares a common module range and innovative operating software with Finetech's automatic die bonding systems to ensure a seamless process migration to series production. Ask us about our scalable solutions. We use the FINEPLACER® lambda 2 for development processes on MEMS, e.g. for precise dispensing and the placement of microstructures. The system fits in with the investment strategy at ISS, where flexible facilities with a wide range of materials enable research into new materials and, in particular, rapid prototyping. Going forward, this will enable us to develop new capabilities for our customers' ideas at an even faster rate.