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Fully-automatic die bonder ISTACK W+
high-accuracy

Fully-automatic die bonder - ISTACK W+ - Kulicke & Soffa - high-accuracy
Fully-automatic die bonder - ISTACK W+ - Kulicke & Soffa - high-accuracy
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Characteristics

Operational mode
fully-automatic
Other characteristics
high-accuracy

Description

With an emerging trend in attaching thinner die and substrates, the iStack™ W+ offers a solution for wafer level die attach. Features & Options High Accuracy kit (5 μm) Mapping Functions (Substrate / Wafer) Wafer / Substrate contamination removal kit OHT / AGV kit UV (In-Situ / Post-Bond) Tool Contamination monitoring kit

Other Kulicke & Soffa products

Die Attach

*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.