Multi-chip die bonder HS-DB3000

epoxyautomated

Overview
HS-DB3000 is a high-speed, multi-functional mounting system engineered for high-volume industrial production. It supports modular customization, intelligent calibration and integrated data management to ensure process traceability and simplified operation. The system includes a 12-inch wafer loading module, automatic wafer changer and automatic nozzle changer to support multi-chip mounting workflows.

Key features

• High-precision positioning and placement.
• Freewheeling, freely adjustable-width conveyor for seamless integration with inline equipment.
• Modular design enabling flexible configuration and scalable production lines.
• 12-inch wafer loading system with automatic wafer changer and automatic nozzle changer for multi-chip mounting.
• Gel control with pressure-time regulation (configurable for special process requirements).
• Height measurement via contact sensor; optional non-contact altimetry.

Application areas

• Photonics
• Power devices
• Microwave RF components
• New energy vehicle components

Technical specifications

• Mounting process: Epoxy adhesive mounting (dipping, scribing); supports face-up and face-down mounting.
• Placement accuracy: ±3 µm (standard); optional ±7 µm, θ ±0.1° depending on application.
• Throughput: 3 s–7 s per placement (application dependent).
• Conveyor adjustment range: 0–200 mm; supports inline/string production.
• Feeding: multi-format feeding; compatible with multi-size blue film; program-controlled switching.
• Placement head: supports up to 12 nozzles for fast changeover and high-performance placement.
• Multi-tasking integration: configurable up to 5 types of glue dipping needles for diverse process needs.
• Wafer handling: 12-inch wafer loading system with automatic wafer changer.
• Nozzle management: automatic nozzle changer.