Multi-chip die bonder LQ-DB10

automatedfully-automaticfor micro assembly

Overview
LQ-DB10 is a fully automatic multi-chip placement system with integrated loading and unloading, engineered for high-precision, high-stability production in semiconductor packaging, Mini LED and related photonics applications. The system supports mixed processing of multiple wafer types and complex components, with modular hardware and configurable process parameters for tailored production.

Key features

• Single-head, triple-wafer-ring design: enables mixed handling of three similar-size 6" chips with an intelligent nozzle library for automatic nozzle changeover.
• Placement performance: placement accuracy up to ±7 μm @ 3σ and angular accuracy ±0.5° @ 3σ.
• High stability and automation: independent control algorithms and modular architecture for repeatable, unattended operation.

Functional features

• Integrated loading/unloading: carrier loading with automatic carrier turnover to streamline throughput.
• Multi-chip handling: supports up to 4 different pickup tools with fixed motion and flexible switching.
• Glue dispensing: horizontal dip-glue mounting with auto-calibrating tip for repeatable adhesive application.
• Feedstock compatibility: supports 2" GEL-PAK and 6" wafer-ring feeding.

Application areas

• Photonics and optical modules
• Power device assembly
• Microwave/RF device assembly
• New energy vehicle electronics and Mini LED production

Advantages

• Modular hardware and configurable process parameters enable customization to specific product mixes and volumes.
• Independent algorithms ensure placement repeatability and stable high-speed operation.

Technical specifications

• Cycle time: approx. 5 s per part (horizontal dip mounting).
• Placement accuracy: up to ±7 μm @ 3σ (typical).
• Rotational/angular accuracy: ±0.5° @ 3σ.
• Alternate/optional accuracy reference: ±10 μm @ 3σ placement; ±0.3° @ 3σ rotation (optional modes).
• Weight: approx. 1400 kg.
• Feeding compatibility: 2" GEL-PAK and 6" wafer ring.