Flip-chip die bonder MD-P200US2

epoxyautomatedfor micro assembly

Panasonic's MD-P200 is a high-productivity die bonder. The synchronous head system offers unparalleled productivity, providing results that surpass conventional die bonders. The wafer supply, pre-centering, bond head and dispenser work in parallel to achieve high-throughput. The MD-P200 solves today's need for small and thin die bonding and offers capabilities for tomorrow's challenges as well. Accurate die pre-centering ensures minimal die tilt and a novel ejector design handles thin dies. Functionality for multi-die packages is also available. • Wafer mapping software capability • Low bond force option • Flexible for multiple die Productivity * 0.65 s / IC for thermosonic bonding (Including process time of 0.2 seconds. Under the fastest conditions) [*1] Placement Accuracy * XY (3 at PFSC conditions) : ±5 µm [*1] Substrate Dimensions (mm) L 50 × W 30 to L 120 × W 120 Die Dimensions (mm) L 0.25 × W 0.25 to L 6 × W 6 Number of Die Types 1 product type (manual wafer supply) / Up to 12 product types (AWC specifications) *Nozzle is one type Die Supply Wafer frame (Max. 8 inch) , Tray Bonding Load VCM head for thermosonic process : 1 N to 50 N (Option : 2 N to 100 N) Head Heating Up to 300℃ for the VCM head Substrate Heating * Constant heating, Up to 300℃