Flip-chip die bonder MD-P200US2

epoxyfor micro assemblyautomated

Panasonic's MD-P200 is a high-productivity die bonder. The synchronous head system offers unparalleled productivity, providing results that surpass conventional die bonders. The wafer supply, pre-centering, bond head and dispenser work in parallel to achieve high-throughput. The MD-P200 solves today's need for small and thin die bonding and offers capabilities for tomorrow's challenges as well. Accurate die pre-centering ensures minimal die tilt and a novel ejector design handles thin dies. Functionality for multi-die packages is also available. • Wafer mapping software capability • Low bond force option • Flexible for multiple die Productivity * - 0.65 s / IC for thermosonic bonding (Including process time of 0.2 seconds. Under the fastest conditions) [*1] Placement Accuracy * - XY (3 at Panasonic conditions) : ±7 µm [*1] Substrate Dimensions (mm) - L 50 × W 30 to L 120 × W 120 Die Dimensions (mm) - L 0.25 × W 0.25 to L 6 × W 6