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Dicer APX300

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Description

With over 25 years industry experience fabricating semiconductors, Panasonic is pleased to introduce our latest plasma dicing solution: APX300. This machine is ideal for thin, brittle, and ultra-small die packages. Achieve ultra-narrow dicing streets at 20μm for thin wafers down to 50μm. And unlike blade dicing, plasma dicing will not induce edge chipping or surface layer stress damage related to mechanical heat. Features & Benefits Damage-free Non-contact Narrow aspect ratio of 2:1

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APX300
APX300
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.