Flip-chip die bonder MD-P300

for micro assembly

Panasonic's process-flexible, MD-P300 flip chip bonder combines flip chip, thermosonic, and thermocompression bonding in a single, small footprint solution. Flexible bonding tools change from thermosonic to C4 to TCB processes directly. It also supports 300mm (12") wafer substrates. The MD-P300 is an ideal solution for COB hybrid assembly with an in-line Panasonic SMT placement machine. Fast cycle times and placement accuracy of +/-5μm at 0.5 seconds per IC (dry run)—with thermosonic and C4 processes at 0.65 seconds, including process times. • Real-time inspection allows you to realize higher manufacturing accuracy • Process versatility • Ideal for processors and CMOS and MEMS power devices • Bonding processes are available by switching the bonding tools, which can be done under the configuration of C4 dipping unit • Bonding stage camera enables post-bonding inspection right after the die bonding. (OP)