Flip-chip die bonder MD-P300

for micro assembly

Panasonic's process-flexible, MD-P300 flip chip bonder combines flip chip, thermosonic, and thermocompression bonding in a single, small footprint solution. Flexible bonding tools change from thermosonic to C4 to TCB processes directly. It also supports 300mm (12") wafer substrates. The MD-P300 is an ideal solution for COB hybrid assembly with an in-line Panasonic SMT placement machine. Fast cycle times and placement accuracy of +/-5μm at 0.5 seconds per IC (dry run)—with thermosonic and C4 processes at 0.65 seconds, including process times. • Real-time inspection allows you to realize higher manufacturing accuracy • Process versatility • Ideal for processors and CMOS and MEMS power devices • Bonding processes are available by switching the bonding tools, which can be done under the configuration of C4 dipping unit • Bonding stage camera enables post-bonding inspection right after the die bonding. (OP) Placement Accuracy * XY (3 at PFSC conditions) : ±5 µm [*1] Substrate Dimensions (mm) L 50 × W 50 to L 330 × W 330 (Heating specifications : L 330 × W 220 mm) Die Dimensions (mm) L 1 × W 1 to L 25 × W 25 ( Thermosonic : L7 × W 7) Number of Die Types Up to 12 product types (AWC specifications) *1 nozzle type Die Supply Wafer frame 12 inches (Option : 8 inches) Bonding Load VCM head : 1N to 50 N (Option : 2 N to 100 N) Head Heating Thermosonic : Up to 300℃ Substrate Heating * Constant heating, Up to 200℃ (Heating bonding stage specifications : Max. substrate size L 330 × W 220 mm) [*2]