The PSX307 plasma cleaner provides 1.5 times the productivity of conventional models. Parallel plate chamber technology delivers superior etch uniformity over conventional batch systems.
Ultra-thin gold-plated electrodes can be wire bonded reliably without nickel compound formation via argon plasma treatment. Gold plating savings alone can provide ROI justification.
Other capabilities include surface modification by oxygen plasma improving mold resin adhesion and under-fill wettability, and reducing incidence of peel-off, voids, and cracks.
Panasonic plasma cleaning equipment sets the standard; thereby, refining tomorrow's technology today.
Features & Benefits
High-speed, uniform parallel plate plasma cleaner
Fast - up to 360 substrates/strips per hour
Highly productive - inline processing for improved bonding, over molding and underfill
Semi S2/S8 compliant
Ar, O2 or mixed gas plasma