Automated die bonder T-5000 series

The T-5000series Die Bonder is what we would like to call an evolution. The result of 40 years experience in developing high quality Die Bonder is based on a new frame concept and fulfils highest requirements for up- to-date applications in R&D and small scall productions of the worldwide microelectronic industry. With increased travel range and our TRUE VERTICAL TECHNOLOGY, higher rigidity, increased image quality and new T-Suite software features, the T-5000serie achieves repeatable accuracy not compromising the proved flexibility and ergonomics.