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Placement accuracy: 0.5 µm
... Semi-automated Sub-Micron Bonder The FINEPLACER® sigma combines sub-micron placement accuracy with a 450 x 150 mm working area and bonding forces up to 1000 N. The system is ideal for all types of precision die ...
... to operate. The T-3002-PRO is a Chip Bonder with programmable and motorised Z-achses. It is also equiped with Tresky's proven die ejector system for pick-up from wafer. Advanced multi functional Die ...
Dr. Tresky AG
... PC software even easier to operate. Advanced multi functional Die Bonder with superior ergonomic design and programmable, high accuracy ZDrive and bonding force control. Die Attach, Die ...
Dr. Tresky AG
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