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Working width: 5 mm - 200 mm
... It is mainly used for double-sided lapping and polishing of metal, non-metal, sapphire, and semiconductor materials, with air bag pressure and disc cooling function ...
... Soils. The PM6 machine is used extensively in: The preparation of Geological Thin Sections: i.e. Rock lapping system The preparation of Semiconductor Materials i.e. Polishing silicon wafers Designed ...
... These series machines are two-axis high-precision single side polishing machines, the polishing head can rotate, swing and work in the high-pressure and high-speed condition, can polish ...
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