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... wide spectrum of 2D and 3D offline inspection tasks: R&D, failure analysis, process and quality control. The Phoenix|x-ray X|act inspection software offers easy to program CAD based µAXI ensuring automated inspection ...
Inspection range width: 580 mm - 580 mm
... Overview
Nikon XT V Series X‑ray CT
inspection systems provide high‑resolution non‑destructive
inspection for electronic components (PCBs, BGAs, chips) and
semiconductor devices. Designed for ...
Nikon Metrology
Inspection range height : 0 mm - 65 mm
... b>Overview
PARMI Xceed is a 3D
AOI (Automated Optical
Inspection) system using a laser line scan method to generate real 3D images. Designed for high-speed, high-accuracy
inspection of SMT and ...
PARMI Europe GmbH
... Overview
- Ultra-Precision 3D AOI for Semiconductor Packaging
- Extremely Fast and High-Resolution Laser Line Scan Method
- Perfect inspection even for highly specular surfaces
- Inspection
PARMI Europe GmbH
... Overview
Ultra-precision 3D Automated Optical
Inspection (AOI) system designed specifically for
semiconductor packaging applications. Optimized for high-speed, high-resolution
inspection of ...
PARMI Europe GmbH
... Full function: Minimum inspection size: 30x30 μ m. Applicable to: quality inspection of semiconductor and SMT stencil. Programming through Gerber file can be completed in 3 ~ 5 minutes. Stencil ...
... cm About the Semi-automated Metrology System The Proforma 300iSA is a benchtop/desktop, semi-automated wafer measurement system for semi-conducting and semi-insulating materials. Based on MTII’s exclusive Push-Pull capacitance technology, ...
... Automatic handlers for test on wafers and power modules • Machines for cutting and soldering of Press-Fit Pins • AOI and 3D Laser for quality control • Robotic handling • Touchless process • AOI ...
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