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... wide spectrum of 2D and 3D offline inspection tasks: R&D, failure analysis, process and quality control. The Phoenix|x-ray X|act inspection software offers easy to program CAD based µAXI ensuring ...
... Full function: Minimum inspection size: 30x30 μ m. Applicable to: quality inspection of semiconductor and SMT stencil. Programming through Gerber file can be completed in 3 ...
Convey weight capacity: 20 kg
... detect integrated circuit chips and semiconductors, including BGA, IGBT, flip chip and PCBA component welding, LED, IC packaging and other industries for high-precision testing. Features of X-ray Inspection ...
Output power: 10 W
Convey weight capacity: 5 kg
... systems for non-destructive inspection of electronic components (PCBs, BGAs, chips and much more). With sub-micron feature recognition, the XT V system range meets today’s need for high performance, non-destructive ...
... cm About the Semi-automated Metrology System The Proforma 300iSA is a benchtop/desktop, semi-automated wafer measurement system for semi-conducting and semi-insulating materials. Based on MTII’s exclusive Push-Pull ...
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