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... wide spectrum of 2D and 3D offline inspection tasks: R&D, failure analysis, process and quality control. The Phoenix|x-ray X|act inspection software offers easy to program CAD based µAXI ensuring automated inspection ...
... front AMHS automation or robot
CIMS
Inspection range width: 450 mm
Inspection range height : 450 mm
Convey weight capacity: 5 kg
... solder
inspection. The platform supports Industry 4.0 standards including IPC-CFX and IPC-HERMES-9852.
Applications
- Bumps
- Flux
- Glue
- Mini-LED solder
- Solder paste
- Surface
TRI Test Research Europe GmbH
Inspection range width: 580 mm - 580 mm
... Overview
Nikon XT V Series X‑ray CT
inspection systems provide high‑resolution non‑destructive
inspection for electronic components (PCBs, BGAs, chips) and
semiconductor devices. Designed for ...
Nikon Metrology
Inspection range height : 0 mm - 65 mm
... b>Overview
PARMI Xceed is a 3D
AOI (Automated Optical
Inspection) system using a laser line scan method to generate real 3D images. Designed for high-speed, high-accuracy
inspection of SMT and ...
PARMI Europe GmbH
... Overview
- Ultra-Precision 3D AOI for Semiconductor Packaging
- Extremely Fast and High-Resolution Laser Line Scan Method
- Perfect inspection even for highly specular surfaces
- Inspection
PARMI Europe GmbH
... Overview
Ultra-precision 3D Automated Optical
Inspection (AOI) system designed specifically for
semiconductor packaging applications. Optimized for high-speed, high-resolution
inspection of ...
PARMI Europe GmbH
... cm About the Semi-automated Metrology System The Proforma 300iSA is a benchtop/desktop, semi-automated wafer measurement system for semi-conducting and semi-insulating materials. Based on MTII’s exclusive Push-Pull capacitance technology, ...
... BM311B Hybrid AOI Machine is mainly applied to the appearance inspection of power semiconductor modules, IPMs, substrates and AMB products, and makes it possible to measure the dimensions ...
Wuxi Autowell Technology Company
... Automatic handlers for test on wafers and power modules • Machines for cutting and soldering of Press-Fit Pins • AOI and 3D Laser for quality control • Robotic handling • Touchless process • AOI ...
... Full function: Minimum inspection size: 30x30 μ m. Applicable to: quality inspection of semiconductor and SMT stencil. Programming through Gerber file can be completed in 3 ~ 5 minutes. Stencil ...
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