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Optical inspection machine Galaxy 10Cχ
for semiconductorsPCBfor the electronics industry

Optical inspection machine - Galaxy 10Cχ - CIMS - for semiconductors / PCB / for the electronics industry
Optical inspection machine - Galaxy 10Cχ - CIMS - for semiconductors / PCB / for the electronics industry
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Characteristics

Technology
optical
Applications
PCB, for semiconductors
Sector
for the electronics industry
Other characteristics
automated, high-resolution, high-speed, in-line, non-contact

Description

Description
AOI for IC Substrates and ultra fine line HDI with minimum line/space support down to 10 µm. Galaxy 10Cχ, CIMS latest generation AOI system equipped with a color camera, is designed to support high-volume manufacturing of advanced IC substrates and ultra fine-line HDI. It scans down to 10 µm line/space width technology and combines high-resolution image acquisition with customizable detection algorithms. The system optical technology Prisma™ Gen II delivers flexible illumination coverage and maximum contrast to enable high-resolution imaging at high scan speeds. Paired with advanced image acquisition and software capabilities, the Galaxy family provides accurate detection with a low false-call rate. Galaxy 10Cχ is powered by Spark™ 3.0, CIMS' latest generation cross-platform detection engine.

Highlights
  • Linear motors for smooth & silent motion
  • Compact mechanical platform
  • 6th generation hardware
  • Enhanced illumination block
  • Fast and intuitive setup for new jobs
  • Compatible with front AMHS automation or robot

Options
  • Fi™ – final inspection option for finished boards
  • +2DM™ metrology – panel dimensions measurement
  • +2CD™ metrology – 2D measurement of circuit elements
  • +3DH™ metrology – 3D measurements of circuit element height
  • +3DP™ metrology – 3D profiling of circuit elements
  • LDI™ – laser drill inspection option
  • CDB™/CDBIC™ – defects classification and virtual defects mapping
  • VVS™ – virtual verification system
  • X-WAVE™ – multi-wave illumination

Specifications
  • Application: AOI for IC Substrates and ultra fine line HDI
  • Minimum line/space supported: down to 10 µm
  • Camera: color camera for high-resolution acquisition
  • Optical technology: Prisma™ Gen II for flexible light coverage and maximum contrast
  • Detection engine: Spark™ 3.0 cross-platform detection engine
  • Performance: high-resolution imaging at high scanning speed with customizable detection algorithms
  • Platform: compact mechanical platform with linear motors for smooth and silent motion
  • Hardware generation: 6th generation hardware
  • Illumination: enhanced illumination block, X-WAVE™ multi-wave option available
  • Automation: compatible with front AMHS automation or robot
  • Metrology options: +2DM™, +2CD™, +3DH™, +3DP™
  • Inspection additions: Fi™ final inspection, LDI™ laser drill inspection
  • Software options: CDB™/CDBIC™ defects classification and virtual mapping; VVS™ virtual verification system
  • Designed for: high-volume manufacturing with low false-call rate

Other CIMS products

PCB Inspection and Metrology

*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.