DescriptionAOI for HDI and multi-layer PCB with min line/space down to 25 µm. Galaxy 25μ, CIMS AOI system, is designed to support high volume manufacturing of HDI and high-end multi-layer PCB. It is capable to scan down to 25 µm line/space width technology.
The system’s state of the art optical technology Microlight™ Gen II provides optimal light coverage in order to be able to meet the most rigorous detection requirements. Optimized performance is achieved by combining superior image quality with customizable detection algorithms.
Equipped with state-of-the-art image acquisition and advanced software capabilities, the Galaxy product family is renowned for its exceptional detection achieved with lowest possible false calls rate. Galaxy 25μ is powered by Spark™ 3.0 – CIMS latest generation cross-platform detection engine.
Highlights- Linear motors for smooth & silent motion
- Compact mechanical platform
- High performance image processing firmware
- Enhanced illumination block (Microlight™ Gen II)
- Fast and intuitive setup for new jobs
- Compatible with front AMHS automation or robot
Options- Fi™ – final inspection option for finished boards
- +2DM™ metrology – panel dimensions measurement
- +2CD™ metrology – 2D measurement of circuit elements
- LDI™ – laser drill inspection option
- CDB™/CDBIC™ – defects classification and virtual defects mapping
- VVS™ – virtual verification system
Caractéristiques / spécifications techniques- Application: Automated Optical Inspection (AOI) for HDI and multi-layer PCBs
- Minimum detectable line/space: down to 25 µm
- Optical technology: Microlight™ Gen II enhanced illumination for optimal light coverage
- Detection engine: Spark™ 3.0 cross-platform detection engine
- Image acquisition: state-of-the-art image acquisition hardware and advanced software capabilities
- Performance: Exceptional detection with low false calls rate via superior image quality and customizable detection algorithms
- Motion system: Linear motors for smooth and silent motion
- Mechanical design: Compact mechanical platform suitable for high volume manufacturing
- Software/firmware: High performance image processing firmware; fast and intuitive job setup
- Automation compatibility: Compatible with front AMHS automation or robot integration
- Available inspection/metrology options: final inspection (Fi™), 2D panel and circuit element metrology (+2DM™, +2CD™), laser drill inspection (LDI™), defects classification and mapping (CDB™/CDBIC™), virtual verification (VVS™)