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Optical inspection system Galaxy Fi 10Cχ
video visioncameraautomated

Optical inspection system - Galaxy Fi 10Cχ - CIMS - video vision / camera / automated
Optical inspection system - Galaxy Fi 10Cχ - CIMS - video vision / camera / automated
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Characteristics

Technology
camera, optical, video vision
Operational mode
automated, robotic
Type
quality, quality control, for defect detection, surface defect, video
Applications
for the electronics industry, for PCB
Configuration
in-line
Other characteristics
high-resolution, computer-controlled, non-contact

Description

Description
Panel final inspection for advanced IC substrates and ultra fine line HDI with minimum detectable line/space down to 10 µm. Galaxy Fi 10Cχ, CIMS' panel-based final inspection system, is equipped with a high-resolution color camera and optimized optical technology to maximize contrast on panels with solder mask and various metal finishes. The system supports reliable defect detection on plated copper, gold plated or OTC, solder mask and bare laminate.

Highlights
  • Linear motors for smooth & silent motion
  • Robust mechanical structure
  • Automated vacuum table for secure handling
  • High-performance image processing firmware
  • Next-generation computer to process large data volumes
  • Fast and intuitive setup for new jobs
  • Compatible with front/back AMHS automation or robot


Options
  • 2DM™ metrology – panel dimensions measurement
  • 2CD™ metrology – 2D measurement of circuit elements
  • 3DH™ metrology – 3D measurement of circuit element height
  • 3DP™ metrology – 3D profiling of circuit elements
  • CDB™/CDBIC™ – defect classification and virtual defect mapping
  • X-WAVE™ – multi-wave illumination


Technical specifications
  • Product family: Galaxy Fi series (final inspection systems)
  • Model: Galaxy Fi 10Cχ
  • Application: Final panel inspection for advanced IC substrates and ultra fine-line HDI
  • Minimum detectable line/space: 10 µm
  • Imaging: color camera with high-resolution image acquisition
  • Optical capability: maximized contrast on solder mask; supports plated copper, gold plated or OTC, solder mask and bare laminate
  • Detection engine: Spark™ 3.0 (cross-platform detection engine)
  • Motion: linear motors for smooth and silent movement
  • Mechanical: robust mechanical structure
  • Handling: automated vacuum table
  • Processing: next-generation computer for large data; high-performance image processing firmware
  • Usability: fast and intuitive job setup
  • Automation compatibility: compatible with front/back AMHS automation or robot
  • Available metrology options: 2DM™, 2CD™, 3DH™, 3DP™
  • Available inspection/analysis options: CDB™/CDBIC™; X-WAVE™

Other CIMS products

PCB Inspection and Metrology

*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.