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Optical inspection system Galaxy Fi 5Cχ
cameraautomatedsurface

Optical inspection system - Galaxy Fi 5Cχ - CIMS - camera / automated / surface
Optical inspection system - Galaxy Fi 5Cχ - CIMS - camera / automated / surface
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Characteristics

Technology
camera, optical
Operational mode
automated
Type
quality control, for defect detection, surface
Applications
for the electronics industry, for PCB
Configuration
in-line
Other characteristics
high-resolution, computer-controlled, non-contact

Description

Description
Panel final inspection for highly advanced IC substrates and ultra fine line HDI with minimum line/space down to 5 µm. Galaxy Fi 5Cχ, CIMS latest panel-based final inspection system, is designed to support final inspection of advanced IC substrates and ultra fine line HDI. It is equipped with a color camera and capable to scan down to 5 µm line/space width technology.
The system’s state-of-the-art optical technology for final inspection is designed to achieve maximum contrast on panels covered by solder mask resist and produced with various metal finishing processes. This technology supports high-resolution image acquisition and ensures reliable detection of defects on plated copper, gold plated/OTC, solder mask and bare laminate.
Equipped with state-of-the-art image acquisition and advanced software capabilities, the Galaxy product family is renowned for its exceptional detection achieved with the lowest possible false calls rate. Galaxy Fi 5Cχ is powered by Spark™ 3.0 – an innovative cross-platform detection engine.

Highlights
  • Linear motors for smooth & silent motion
  • Robust mechanical structure
  • Automated vacuum table
  • High performance image processing firmware
  • Next generation computer to process large data
  • Fast and intuitive setup for new jobs
  • Compatible with front/back AMHS automation or robot

Options
  • +2DM™ metrology – panel dimensions measurement
  • +2CD™ metrology – 2D measurement of circuit elements
  • +3DH™ metrology – 3D measurements of circuit element height
  • +3DP™ metrology – 3D profiling of circuit element
  • CDB™/CDBIC™ – defects classification and virtual defects mapping
  • X-WAVE™ – multi-wave illumination

Technical specifications
  • Minimum line/space inspection capability: 5 µm
  • Imaging: color camera, high resolution image acquisition
  • Optical technology optimized for solder mask, plated copper, gold plated/OTC and bare laminate
  • Detection engine: Spark™ 3.0 cross-platform detection engine
  • Motion: linear motors for smooth and silent movement
  • Mechanical: robust structure with automated vacuum table
  • Processing: high performance image processing firmware and next generation computer for large data
  • Usability: fast and intuitive job setup
  • Automation: compatible with front/back AMHS automation or robots
  • Available metrology and analysis options: +2DM™, +2CD™, +3DH™, +3DP™, CDB™/CDBIC™, X-WAVE™

Other CIMS products

PCB Inspection and Metrology

*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.