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Optical inspection system Galaxy Fi 7Cχ
cameraautomatedrobotic

Optical inspection system - Galaxy Fi 7Cχ - CIMS - camera / automated / robotic
Optical inspection system - Galaxy Fi 7Cχ - CIMS - camera / automated / robotic
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Characteristics

Technology
camera, optical
Operational mode
automated, robotic
Type
quality, for defect detection, measurement, surface
Applications
for the electronics industry, for PCB
Other characteristics
high-resolution, computer-controlled

Description

Description
Panel final inspection for advanced IC Substrates and ultra fine line HDI with minimum line/space capability down to 7 µm. Galaxy Fi 7Cχ, CIMS latest panel-based final inspection system, is designed to support final inspection of advanced IC substrates and ultra fine line HDI. It is equipped with a color camera and capable of scanning down to 7 µm line/space width technology. The system’s state-of-the-art optical technology for final inspection is designed to achieve maximum contrast on panels covered by solder mask resist and produced with various metal finishing processes. This technology supports high-resolution image acquisition and ensures reliable detection of defects on plated copper, gold plated or OTC, solder mask and bare laminate. Equipped with state-of-the-art image acquisition and advanced software capabilities, the Galaxy product family is renowned for exceptional detection with the lowest possible false-call rate. Galaxy Fi 7Cχ is powered by Spark™ 3.0 – an innovative cross-platform detection engine.

Highlights
  • Linear motors for smooth & silent motion
  • Robust mechanical structure
  • Automated vacuum table
  • High-performance image processing firmware
  • Next-generation computer to process large data volumes
  • Fast and intuitive setup for new jobs
  • Compatible with front/back AMHS automation or robot

Options
  • +2DM™ metrology – panel dimensions measurement
  • +2CD™ metrology – 2D measurement of circuit elements
  • +3DH™ metrology – 3D measurements of circuit element height
  • +3DP™ metrology – 3D profiling of circuit elements
  • CDB™/CDBIC™ – defects classification and virtual defects mapping
  • X-WAVE™ – multi-wave illumination

Caractéristiques / spécifications techniques
  • Application: Panel final inspection for advanced IC Substrates and ultra fine line HDI
  • Minimum line/space capability: 7 µm
  • Imaging: Color camera, high-resolution image acquisition
  • Optical technology: Designed for maximum contrast on solder mask resist and various metal finishes
  • Supported materials/finishes: Plated copper, gold plated (or OTC), solder mask, bare laminate
  • Software/detection engine: Spark™ 3.0 cross-platform detection engine
  • Motion: Linear motors for smooth and silent motion
  • Mechanics: Robust mechanical structure; automated vacuum table
  • Processing hardware: Next-generation computer to process large data volumes
  • Automation: Compatible with front/back AMHS automation or robot
  • Available metrology/options: 2DM™, 2CD™, 3DH™, 3DP™, CDB™/CDBIC™, X-WAVE™

Other CIMS products

PCB Inspection and Metrology

*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.