Exhibit with us
*mydirectindustry  
English
  1. Metrology - Laboratory
  2. Inspection and Monitoring
  3. Optical inspection system
  4. CIMS
  • Products
  • Catalogs
  • News & Trends
  • Exhibitions

Optical inspection system Galaxy 5Cχ
cameraautomaticfor defect detection

Optical inspection system - Galaxy 5Cχ - CIMS - camera / automatic / for defect detection
Optical inspection system - Galaxy 5Cχ - CIMS - camera / automatic / for defect detection
Add to favorites
Compare this product

Characteristics

Technology
camera, optical
Operational mode
automatic
Type
quality control, for defect detection
Applications
for the electronics industry, for PCB
Configuration
in-line
Other characteristics
high-resolution, non-contact

Description

Description
Automated Optical Inspection (AOI) for IC substrates, the Galaxy 5Cχ supports minimum line/space technology down to 5 µm. Designed for high-volume manufacturing, it combines high-resolution color imaging with advanced optical and detection engines to identify process and assembly defects on advanced substrates.

Key capabilities
  • Inspection down to 5 µm line/space for advanced IC substrate technologies
  • High-resolution color camera for enhanced feature recognition
  • Prisma™ Gen II optical technology for flexible illumination and maximum contrast
  • Spark™ 3.0 cross-platform detection engine with customizable algorithms
  • Optimized balance of resolution and scanning speed for high throughput


Highlights
  • Linear motors for smooth, low-noise motion
  • Compact mechanical platform for factory floor integration
  • 6th generation hardware for improved processing and reliability
  • Enhanced illumination block with optional X-WAVE™ multi-wave illumination
  • Fast and intuitive job setup to reduce changeover time
  • Compatible with front AMHS automation or robot handling


Options
  • Fi™ — final inspection option for finished boards
  • +2DM™ metrology — panel dimensions measurement
  • +2CD™ metrology — 2D measurement of circuit elements
  • +3DH™ metrology — 3D height measurement of circuit elements
  • +3DP™ metrology — 3D profiling of circuit elements
  • LDI™ — laser drill inspection option
  • CDB™ / CDBIC™ — defect classification and virtual defect mapping
  • VVS™ — virtual verification system
  • X-WAVE™ — multi-wave illumination option


Technical specifications
  • Application: Automated Optical Inspection (AOI) for IC substrates
  • Minimum line/space capability: 5 µm
  • Camera: high-resolution color camera
  • Optical technology: Prisma™ Gen II (flexible illumination, high contrast)
  • Detection engine: Spark™ 3.0 (cross-platform, customizable algorithms)
  • Motion system: linear motors for smooth, silent motion
  • Mechanical design: compact platform suitable for integration
  • Hardware generation: 6th generation hardware
  • Illumination: enhanced illumination block; X-WAVE™ optional
  • Metrology options: +2DM™, +2CD™, +3DH™, +3DP™
  • Additional options: Fi™, LDI™, CDB™/CDBIC™, VVS™
  • Automation compatibility: compatible with front AMHS automation or robot handling

Other CIMS products

PCB Inspection and Metrology

*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.