Optical inspection machine Xceed

3Dfor semiconductorsPCB

Overview
PARMI Xceed is a 3D AOI (Automated Optical Inspection) system using a laser line scan method to generate real 3D images. Designed for high-speed, high-accuracy inspection of SMT and semiconductor assemblies, it supports components up to 65 mm in height. The system is insensitive to color, material and surface roughness, enabling detection of foreign material, contamination and PCB warpage without additional cycle time.

Key features

• 3D AOI
• Laser line scan method
• Real 3D imaging
• Industry-leading inspection speed (manufacturer claim)
• Inspection insensitive to color, material and surface roughness
• Supports inspection of components up to 65 mm height
• Detects foreign material, contamination and PCB warpage without additional cycle time

Inspection items

• Dimension
• Missing
• Misalignment
• Wrong component
• Side mount
• Tombstone
• Text (OCR/OCV)
• Solder joint
• Lead lift
• Lead missing
• Lead offset
• Bridge
• Color band
• Pin
• Coplanarity
• etc.

Technical specifications

• Model name: Xceed
• Manufacturer / Brand: PARMI
• Technology: 3D AOI using laser line scan method
• Imaging: Real 3D image
• Maximum inspection height: up to 65 mm
• Inspection robustness: insensitive to color, material and surface roughness
• Target inspections: foreign material & contamination detection, PCB warpage, component and solder inspections
• Typical inspection items supported: Dimension, Missing, Misalignment, Wrong component, Side mount, Tombstone, OCR/OCV, Solder joint defects, Lead issues, Bridge, Color band, Pin, Coplanarity, etc.
• Application areas: SMT and semiconductor assembly inspection