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Output power: 4 kW
Inspection range width: 780 mm - 1,000 mm
Inspection range height : 260 mm - 660 mm
... : 4850 kg
Power Requirement: 200 - 240 VAC single phase, 50/60 Hz, 4 kVA
Inspection Performance Notes
Designed for very high-resolution
inspection (down to 2 µm) with CT capabilities and AI-driven ...
... The 3935 and 3920 EP broadband plasma defect inspection systems support wafer-level defect discovery, yield learning and inline monitoring for ≤5nm logic and leading-edge memory design nodes. With a light source that ...
KLA Corporation
... li>
... : high-throughput thickness measurement by XRR and XRF, low-contamination wafer handling and pattern recognition-based position control for product wafer measurements, CE Marking and S2/S8 Compliance ...
... for the thickness, roughness, total thickness variation(TTV) of the wafer. Roughness measurement for unpatterned wafer During rough grinding and fine grinding process for the Wafer thinning, the ...
...
Inspection items
- Wafer die inspection: chipping, contamination and related die defects
- Bump inspection: height, offset, coplanarity and bump characteristic
... The Firefly inspection series provides an automated inspection solution for high performance applications like FPGA, CPU/GPU and networking servers in addition to applications with low I/O counts: IC drivers, RF transceivers, ...
Onto Innovation Inc.
... is a benchtop/desktop, semi-automated wafer measurement system for semi-conducting and semi-insulating materials. Based on MTII’s exclusive Push-Pull capacitance technology, the Proforma 300iSA delivers full wafer ...
... Ball AOI / Bump AOI Prodcut Presentation Particle inspection equipment MRD-3100 series for COG, FOG, and COF products, particularly for the binding defect detection of LCD display module. Leading in ...
... Incident light microscope for wafer inspection granite base in portal design incident light tube with lens turret vacuum waferchuck ...
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