Optical inspection machine ARTION

3Dfor wafersfor semiconductors

Product line
Xceed MICRO │ AXION │ PRECION │ ARTION

Overview
Ultra-precision 2D & 3D automatic optical inspection (AOI) system designed for wafer-level inspection. Provides high-resolution color image acquisition and integrated inspection result management to support production and process control in semiconductor manufacturing.

Key features

• Combined 2D and 3D AOI for comprehensive defect detection
• High-resolution color imaging for enhanced defect discrimination
• Intuitive teaching interface and detailed inspection result management
• EFEM interworking support (Equipment Front-End Module) for automated line integration
• High-precision granite X/Y/Z motion stage for stable, repeatable positioning

Wafer handling & mechanics

• Support for 8in and 12in ringframe wafers
• Flexible multi-load port configurations and dual-arm handling options
• Stable porous vacuum chuck design for secure wafer placement

Inspection items

• Wafer die inspection: chipping, contamination and related die defects
• Bump inspection: height, offset, coplanarity and bump characteristic analysis

Applications

• Wafer-level AOI in semiconductor and MEMS production
• Advanced inspection tasks requiring combined 2D/3D metrology and color imaging

Technical specifications

• Ultra-precision 2D & 3D AOI optical system
• High-resolution color image acquisition unit
• User-friendly teaching interface and inspection result management tools
• EFEM interworking capability
• High-precision granite X/Y/Z motion stage
• Support for 8in and 12in ringframe wafers
• Multi load port and dual-arm wafer handling configurations
• Porous vacuum chuck for stable wafer fixation
• Inspection scope: wafer die (chipping, contamination), bump (height, offset, coplanarity)