Optical inspection machine AXION

3Dfor semiconductorsfor the electronics industry

Overview
Ultra-precision 3D Automated Optical Inspection (AOI) system designed specifically for semiconductor packaging applications. Optimized for high-speed, high-resolution inspection of glossy and varied-material surfaces with a built-in magazine loader/unloader.

Key Features

• Ultra-precision 3D AOI using a high-resolution laser line-scan method
• Built-in magazine loader/unloader for streamlined material handling
• Extremely fast capture and processing for high throughput
• Inspection performance insensitive to color, material or surface roughness
• Effective inspection of highly specular (reflective) surfaces

Inspection Items

• SiP (System-in-Package)
• Die attach
• Underfill
• Solder paste and bump
• Cu clip on die
• IGBT
• Other semiconductor packaging components

Product Positioning / Family

• Part of the Xceed MICRO product family (Xceed MICRO │ AXION │ PRECION │ ARTION)

Technical specifications

• Manufacturer: PARMI
• Model name: AXION
• Application: Semiconductor packaging inspection
• Imaging method: High-resolution laser line-scan
• Loader type: Magazine loader/unloader built-in
• Designed for: Inspection insensitive to color, material and surface roughness; optimized for highly specular surfaces
• Inspection items supported: SiP, die attach, underfill, solder paste & bump, Cu clip on die, IGBT, etc.