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Optical inspection machine Xceed MICRO3Dfor semiconductorsfor the electronics industry
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Characteristics
- Technology
- optical, 3D
- Applications
- for semiconductors
- Sector
- for the electronics industry
- Other characteristics
- automated, measurement, high-resolution, high-speed
Description
Overview
Inspection Items
Product family
Caractéristiques / spécifications techniques
- Ultra-Precision 3D AOI for Semiconductor Packaging
- Extremely Fast and High-Resolution Laser Line Scan Method
- Perfect inspection even for highly specular surfaces
- Inspection performance irrelevant to color, material, or surface roughness
Inspection Items
- SiP (System in Package)
- Die attach
- Underfill
- Solder paste and bump
- Cu clip on die
- IGBT
- Other semiconductor packaging related items
Product family
- Xceed MICRO (presented on this page)
- Related product names on site: AXION, PRECION, ARTION
Caractéristiques / spécifications techniques
- Type: 3D AOI (Automated Optical Inspection) for semiconductor packaging
- Imaging method: Laser line scan (extremely fast, high-resolution)
- 3D measurement capability for ultra-precision inspection
- Designed to inspect highly specular (reflective) surfaces
- Inspection insensitive to variations in color, material, and surface roughness
- Typical inspection targets: SiP, die attach, underfill, solder paste & bump, Cu clip on die, IGBT, etc.
Other PARMI Europe GmbH products
Semiconductor
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.