X-ray inspection machine TR7600F3D SII Plus

computed tomographyCT3D

Introduction
The TR7600F3D SII Plus is a 2 µm high-resolution 3D AXI with CT capabilities, developed for high-reliability industries including Advanced Packaging, Automotive, Aerospace and Medical. It integrates AI-driven inspection algorithms for void and open-defect detection, a next-generation 110 kV X-ray source and high-resolution detectors to identify minute anomalies and support stringent quality requirements.

Applications / Detected Components

• BGAs
• Backdrill
• Barrel fill
• Capacitors
• Resistors
• Chips
• Components under RF shields
• WLCSP
• DIMM Connectors
• Flip-Chips
• Ground Pads
• Gullwing
• Heat sinks
• J-Leads
• LED Chips
• LGAs
• Paladin Connector
• RNET
• SiP
• SMT Connectors
• SOIC, SOT
• Thermal Pad
• QFNs, QFP
• THTs

Key Features

• 2 µm high-precision 3D CT X-ray suitable for high-reliability electronics manufacturing
• AI-powered algorithms for precise detection of voids and opens
• Large board handling (up to 1000 x 660 mm for LL variant)
• Smart board warpage control
• 2D camera functionality for automotive needs (barcode, fiducial, bare-board marking reading)
• Smart Factory ready with MES connectivity options
• Designed for ease of maintenance and radiation-safe operation
• Target markets: Advanced Packaging, Automotive, Aerospace, Medical

Imaging System
Camera type: Flat Panel Detector
X-ray Source: 60 - 110 kV
Imaging Resolution: 2 µm - 30 µm
Inspection Method: 2D, 2.5D, 3D Slicing, Planar CT (Optional)

Motion Table & Control
X Axis Control: High-precision ballscrew + AC-servo controller (optional: Dual-driven high-precision ball screw + AC-servo)
Y Axis Control: High-precision ballscrew + AC-servo controller (LL variant: Dual-driven high-precision ball screw + AC-servo)
Z Axis Control: High-precision ballscrew + AC-servo controller

Board Handling
Max. PCB Size: TR7600F3D SII Plus: 780 x 260 mm; TR7600F3D LL SII Plus: 1000 x 660 mm
PCB Thickness: SII Plus: 0.6 - 7 mm; LL SII Plus: 0.4 - 7 mm
Max. PCB Weight: 12 kg
Top Clearance: @20/25/30 µm: 50 mm; @15 µm: 30 mm; @10 µm: 20 mm; @5 µm: 8 mm; @2/3 µm: 3 mm
Bottom Clearance: @25/30 µm: 50 mm; @15/20/25 µm: 55 mm; @10 µm: 65 mm; @2/3/5 µm: 70 mm
Edge Clearance: 3 mm or 5 mm
Conveyor: 880 - 920 mm (Optional: 940 - 965 mm) - SMEMA compatible

Inspection Functions

• Capabilities: BGAs, Backdrill, Barrel fill, Capacitors, Resistors, Chips, Components under RF shields, WLCSP, DIMM Connectors, Flip-Chips, Ground Pads, Gullwing, Heat sinks, J-Leads, LED Chips, LGAs, Paladin Connector, RNET, SiP, SMT Connectors, SOIC, SOT, Thermal Pad, QFNs, QFP, THTs
• Detectable Defects: Missing, Misalignment, Tombstone, Billboard, Tantalum Polarity, Rotation, Foreign Material, Insufficient/Excess Solder, Bridging, Open, Solder Ball, Non-Wetting, Void, Lifted Lead

Dimensions & Mechanical
WxDxH: TR7600F3D SII Plus: 1470 x 1971 x 1975 mm; TR7600F3D LL SII Plus: 1730 x 2300 x 1975 mm (note: not including signal tower, height: 519 mm)
Weight: TR7600F3D SII Plus: 3850 kg; TR7600F3D LL SII Plus: 4850 kg
Power Requirement: 200 - 240 VAC single phase, 50/60 Hz, 4 kVA

Inspection Performance Notes
Designed for very high-resolution inspection (down to 2 µm) with CT capabilities and AI-driven algorithms to detect minute voids and open defects for advanced packaging and other high-reliability applications.

Technical Specifications

• Model: TR7600F3D SII Plus
• Imaging detector: Flat Panel Detector
• X-ray source: 60 - 110 kV (next-generation 110 kV capability)
• Imaging resolution: 2 µm - 30 µm
• Inspection methods: 2D, 2.5D, 3D Slicing, Planar CT (optional)
• Max PCB size: 780 x 260 mm (SII Plus) / 1000 x 660 mm (LL SII Plus)
• PCB thickness range: 0.6 - 7 mm (SII Plus) / 0.4 - 7 mm (LL SII Plus)
• Max PCB weight: 12 kg
• Top clearance (varies by resolution): down to 3 mm (@2/3 µm)
• Bottom clearance (varies by resolution): up to 70 mm (@2/3/5 µm)
• Conveyor height: 880 - 920 mm (optional 940 - 965 mm), SMEMA compatible
• Motion control: high-precision ballscrew + AC-servo controller (dual-driven ball-screw optional)
• Dimensions (WxDxH): 1470 x 1971 x 1975 mm (SII Plus); 1730 x 2300 x 1975 mm (LL SII Plus)
• Weight: 3850 kg (SII Plus); 4850 kg (LL SII Plus)
• Power: 200 - 240 VAC single phase, 50/60 Hz, 4 kVA