CCD inspection system TR7600 SIII Plus

X-raycameraAI

Introduction
The TR7600 SIII Plus is TRI's high-throughput 3D SEMI AXI system designed for high-reliability industries like Semiconductor, Advanced Packaging, Automotive, Aerospace, and Medical. Equipped with Multi-Resolution (2 µm - 20 µm) capabilities, the 3D SEMI AXI ensures fast, accurate inspection of components such as C4 bumps, SiP, and Cu Pillars. The TR7600 SIII Plus supports large board sizes up to 800 x 350 mm and weights up to 12 kg. Powered by AI algorithms, including AI-Void Detection and AI Repair Station, the TR7600 SIII Plus ensures enhanced defect detection.

Features

• High Speed 3D SEMI AXI optimized to meet throughput demands of OSATs
• AI-powered inspection algorithms for precise defect detection (including AI-Void Detection and AI Repair Station)
• Inspection capabilities for C4 bumps (70 µm to 140 µm) and Cu Pillars
• Flexible Multi-Resolution platform: 2 – 20 µm production
• Inline fine-tuning without interrupting production
• Large board inspection up to 800 mm x 350 mm, up to 12 kg in weight
• Smart Factory ready with MES connectivity
• Applications: Advanced Packaging, Automotive, Aerospace, Medical

Imaging System
Camera: Ultra-High Speed Line-Scan CCD Cameras
X-ray Source: 60 - 110 kV
Imaging Resolution: 2 μm - 20 μm
Inspection Method: 2D, 2.5D, 3D Slicing, Planar CT (Optional)

Motion Table & Control
X Axis Control: High-precision ballscrew + AC-servo controller
Y Axis Control: High-precision ballscrew + AC-servo controller
Z Axis Control: High-precision ballscrew + AC-servo controller

Board Handling
Max. PCB Size: 2 μm - 3 μm: 245 x 100 mm
7 μm - 20 μm: 800 x 350 mm
PCB Thickness: 0.6 - 7 mm (Optional: 0.4 mm configurations noted)
Max. PCB Weight: 12 kg (optional config noted: 3 kg for 0.4 mm option)
Top Clearance: @20 μm: 50 mm
@15 μm: 45 mm
@10 μm: 29 mm
@7 μm: 19 mm
@3 μm: 5 mm
@2 μm: 3 mm
Note: Calibration is required for non-standard resolutions.
Bottom Clearance: 70 mm
Edge Clearance: 3 mm or 5 mm
Conveyor: 880 – 920 mm (Optional: 940 - 965 mm) — SMEMA Compatible

Inspection Functions
Capabilities

• BGAs
• Backdrill
• Barrel fill
• Capacitors
• Resistors
• Chips
• Components under RF shields
• WLCSP
• DIMM Connectors
• Flip-Chips
• Ground Pads
• Gullwing
• Heat sinks
• J-Leads
• LED Chips
• LGAs
• Paladin Connector
• RNET
• SiP
• SMT Connectors
• SOIC
• SOT
• Thermal Pad
• QFNs
• QFP
• THTs

Defects Detected

• Missing
• Misalignment
• Tombstone
• Billboard
• Tantalum Polarity
• Rotation
• Foreign Material
• Insufficient/Excess Solder
• Bridging
• Open
• Solder Ball
• Non-Wetting
• Void
• Lifted Lead

Dimensions
WxDxH: 1470 x 1971 x 1975 mm (Note: not including signal tower, signal tower height: 519 mm)
Weight: 3870 kg
Power Requirement: 200 - 240 VAC single phase, 50/60 Hz, 4 kVA

Downloads / Member content
Member-only downloads and content require login and are not included here.

Technical Specifications

• Model: TR7600 SIII Plus
• Imaging resolution: 2 μm – 20 μm
• X-ray source voltage: 60 – 110 kV
• Imaging methods: 2D, 2.5D, 3D slicing; Planar CT optional
• Camera: Ultra-high speed line-scan CCD cameras
• Motion control: High-precision ballscrew with AC-servo controllers on X, Y, Z axes
• Max PCB size (production-dependent): up to 800 x 350 mm (for 7–20 μm); 245 x 100 mm at 2–3 μm
• Max PCB weight: 12 kg
• PCB thickness range: 0.6 – 7 mm (optional 0.4 mm configurations noted)
• Top clearance examples: 50 mm (@20 μm), 3 mm (@2 μm)
• Bottom clearance: 70 mm
• Edge clearance: 3 mm or 5 mm
• Conveyor height: 880 – 920 mm (optional 940 – 965 mm); SMEMA compatible
• WxDxH (machine): 1470 x 1971 x 1975 mm
• Machine weight: 3870 kg
• Power: 200–240 VAC, single phase, 50/60 Hz, 4 kVA
• AI features: AI-Void Detection, AI Repair Station