X-ray inspection machine MFM310

for wafershigh-resolution

MFM310 The Rigaku MFM310 performs high-precision measurements not possible by optical or ultrasonic techniques. This sophisticated X-ray metrology tool makes it practical to perform high-throughput measurements on product and blanket wafers ranging from ultrathin single-layer films to multilayer stacks. Designed for high-volume manufacturing The MFM310 is designed with high-volume 200mm and 300mm manufacturing in mind: high-throughput thickness measurement by XRR and XRF, low-contamination wafer handling and pattern recognition-based position control for product wafer measurements, CE Marking and S2/S8 Compliance for semiconductor production clean room operation, compliance with GEM-300/HSMS and factory automation standards, high-reliability machine performance and low power consumption and cost of ownership. COLORS™ enabling technology COLORS™ X-ray optics were developed by Rigaku for the MFM310 to enable measurements from small areas. COLORS beam modules couple a variety of XRF excitation sources with optics and are optimized to provide high brightness in small spots for a variety of thin film applications. With its own x-ray optics business, Rigaku is well-positioned develop and manufacture X-ray sources for current and future market needs. Features Micro-spot X-ray beams and pattern recognition High-throughput, product-wafer measurements Wide range of materials and applications High resolution and precision covering thicknesses from Ångstroms to microns For 200mm and 300mm wafers Available with 300mm factory automation Design based on SEMI S2 and SEMI S8