3D inspection machine WD4000

for unpatterned wafersfor the electronics industrymeasurement

Appliction: Thickness and warpage measurement for unpatterned wafer The 3D shape based on the upper and lower surfaces of the wafer is reconstructed by non-contact measurement. The powerful measurement and analysis software ensures the stable calculation for the thickness, roughness, total thickness variation(TTV) of the wafer. Roughness measurement for unpatterned wafer During rough grinding and fine grinding process for the Wafer thinning, the surface roughness Sa values and their stability are used to evaluate the processing quality. When the thinned silicon wafer is measured in the strong noise environment of the production workshop, the roughness Sa values of the fine grinding silicon wafers are ranging around 5nm, and the repeatability is 0.046987nm based on 25 times of measurement data which proves the measurement stability is good.