Roughness measuring machine WD4200

thicknessopticalautomatic

Unpatterned Wafer 3D Inspection System WD4000 series can automatically measure wafer thickness, surface roughness, and micro-nano 3D microtopography at a time. Use white light confocal probes to measure wafer thickness, TTV, LTV, BOW, WARP, line roughness; use white light interferometry probe to scan the Wafer surface to create a 3D profile image of the surface , then analyze the roughness and relevant 2D and 3D parameters according to ISO/ASME/EUR/GBT standards. The 3D shape based on the upper and lower surfaces of the wafer is reconstructed by non-contact measurement. The powerful measurement and analysis software ensures the stable calculation for the thickness, roughness, total thickness variation(TTV) of the wafer.