Thickness measuring machine BOKI_1000

volumeoptical3D

Patterned Wafer Critical Dimension & Overlay Measurement System is an optical inspection instrument that can perform both high-precision XY plane dimension inspection and sub-nanometer surface 3D topography measurement. It can scan multiple regions on a large surface accurately and automatically with excellent repeatability, which significantly increases the measurement efficiency and reduces human error. Equipping high-resolution optical lens, combining high-precision image analysis algorithm, in CNC mode the system can automatically position & recognize the measuring objects, then automatically measure and evaluate all sizes according to program. At the same time, it integrates white light interferometry measurement system, which can scan the wafer surface to create a 3D profile image of the surface, then analyze Z-direction sizes in nanometer level. It is widely used in ultra-precision machining industries such as semiconductor manufacturing and packaging process inspection, optical processing, MEMS components, etc. Application Overlay Offset Measurement Key Dimensions Measurement 3D Dimensions Measurement Etch Depth Measurement and Profile Analysis Laser Groove Depth and Width Measurement