Optical inspection machine 39 series

for patterned wafersindustrialfor the electronics industry

The 3935 and 3920 EP broadband plasma defect inspection systems support wafer-level defect discovery, yield learning and inline monitoring for ≤5nm logic and leading-edge memory design nodes. With a light source that produces super resolution deep ultraviolet (SR-DUV) wavelength bands, low noise sensors and advanced algorithms, the 3935 and 3920 EP provide high sensitivity capture of unique defect types. The 3935 also includes technologies that enable quick resolution of defect issues, including Setup 2.0 infrastructure for scalable enhancements to inspection recipe setup, and DualSENS™ linkage between the 3935 optical inspector and e-beam review systems for enhanced defect sensitivity on low contrast layers. The 3920 EP includes several memory-specific algorithm and binning innovations that support capture and monitoring of critical defects for 3D NAND and DRAM devices. With throughput that supports inline monitoring requirements, the 3935 and 3920 EP pair sensitivity with speed, enabling Discovery at the Speed of Light™, for reduction of the time required to deliver wafer-level data for complete characterization of process issues during development and high volume manufacturing. Defect discovery, Hotspot discovery, Process debug, EUV print check, Engineering analysis, Line monitoring, Process window discovery Optical broadband plasma wafer defect inspectors with super resolution deep ultraviolet (SR-DUV) wavelength bands that provide discovery of critical defects on logic and memory devices.