Optical inspection machine eDR7380™

for wafersfor the electronics industrydefect

e-Beam Wafer Defect Review and Classification Systems The eDR7380™ electron-beam (e-beam) wafer defect review and classification system supports wafer and chip manufacturing for wide-bandgap semiconductors. It provides high resolution images of defects and uses machine-learning automatic defect classification to produce an accurate defect pareto. The data generated by the eDR7380 enables faster defect sourcing in development, faster excursion detection, and more accurate, actionable data during production. The defect information produced by the eDR7380 helps accelerate time to market for multiple substrate types (SiC, GaN, glass, sapphire, POI (piezoelectric-on-insulator), etc.) and device types (power, LED, photonics, RF, MEMS, etc.). Built on a flexible, configurable platform, the eDR7380 reviews and classifies a wide range of defect sizes and types for multiple wafer sizes (150mm, 200mm, 300mm) and wafer thicknesses (180µm to 1500µm). eDR® is a registered trademark of KLA Corporation. Defect imaging, Automatic inline defect classification and performance management, Bare wafer outgoing and incoming quality control, Wafer dispositioning, Defect discovery, Process window discovery, Process window qualification, Bevel edge review, Energy-dispersive x-ray (EDX) composition analysis The eDRX1 e-beam wafer defect review and classification system supports production of silicon-based wafers and chips.