The Surfscan® SP7XP unpatterned wafer inspection system identifies defects and surface quality issues that affect the performance and reliability of leading-edge logic and memory devices. It supports IC, OEM, materials and substrate manufacturing by qualifying and monitoring tools, processes and materials, including those used for EUV lithography. Using a DUV laser and optimized inspection modes, the Surfscan SP7XP delivers ultimate sensitivity for advanced node R&D and the throughput to support high volume manufacturing. Complementary detection modes, including the phase contrast channel (PCC) and normal illumination (NI), detect unique defect types for bare wafers, smooth and rough films, and fragile resists and litho stacks. Image based defect classification (IBC) using revolutionary machine learning algorithms support faster time to root cause, while the Z7™ classification engine supports unique 3D NAND and thick film applications.
Process qualification, Tool qualification, Tool monitoring, Outgoing wafer quality control, Incoming wafer quality control, EUV resist and scanner qualification, Process debug
Recipe management system that facilitates recipe portability between compatible Surfscan systems, helping streamline fleet management within fabs.
Unpatterned wafer surface inspection system with DUV sensitivity and high throughput for IC, substrate and equipment manufacturing at the sub 1Xnm design nodes.
Unpatterned wafer surface inspection system with DUV sensitivity and high throughput for IC, substrate and equipment manufacturing at the 1Xnm design nodes.