Optical inspection machine C30x

for patterned wafersfor the electronics industrydefect

TThe C30x Series broadband plasma optical defect inspectors enable systematic defect discovery and latent reliability defect detection for chip manufacturing for the automotive, IoT, 5G, consumer electronics and industrial (military, aerospace, medical) markets. The C30x inspectors leverage a tunable broadband illumination source, advanced optics and a low noise sensor to capture critical defects across a range of process layers and device types. NanoPoint™ technology focuses inspection on pattern areas at high risk for reliability failures, delivering actionable defect data that helps reduce die underkill and overkill. Through discovery of systematic defects, the C30x inspectors help accelerate characterization and optimization of new processes, design nodes and devices during R&D. In production, the C30x systems’ high sensitivity at optical inspection speed enable inline monitoring for critical process layers, helping fabs avoid defect excursions that affect final chip quality. The C30x inspectors are built on an extendible, configurable platform, supporting both 200mm and 300mm wafer sizes. The C30x broadband plasma inspectors include the following technologies: Broadband plasma illumination source With a high brightness DUV/UV/visible light source, the C30x Series inspectors attain increased signal to critical defects. Tunable wavelength bands Numerous wavelength bands offer the operational flexibility required to achieve optimal contrast for different process layers and device types. Multiple pixels The C30x includes small pixel sizes, enabling detection of the tiny, critical defects that affect device yield and reliability. High data rate sensor