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... Physical Vapor Deposition (PVD) is a thin-film process that produces coatings of conducting, semiconducting or insulating materials onto a wafer surface. There are different forms of PVD: sputtering, evaporation, ion-beam deposition. ...
KLA Corporation
... Enhanced Chemical Vapor Deposition (PECVD) is a process which uses the energy within a plasma to accelerate chemical reactions at the wafer surface to produce thin films at temperatures below 400°C. Energetic ion bombardment during deposition ...
KLA Corporation
... advanced packaging applications, the SPTS Osprey® PECVD system offers low temperature deposition processes compatible with 300mm bonded substrates and mold. Osprey® PECVD produces high quality, production qualified dielectric ...
KLA Corporation
... constantly aluminum metallization on plastic film single side’s coating, like PET, PE substrates. Which is used for high quality packaging material manufacturing. 1. The web coating system adopts advanced round chamber structure, ...
Shanghai Royal Technology Inc.
... Roll-to-Roll) web aluminum vacuum metallizers are machines used to deposit a thin layer of aluminum onto flexible substrates in a continuous process, which is commonly employed in a variety of industries such as packaging, ...
Shanghai Royal Technology Inc.
... semiconductor / electronic industries. One typical application is Ceramic Radiating Substrate. Cooper conductive film deposition on Al2O3, AlN, Si, Glass substrates by PVD vacuum sputtering technology, compared with traditional manufacturing ...
Shanghai Royal Technology Inc.
... cycle) which connect with Plastic Injection machine, after injection the parts go to PVD chamber directly for PVD+ HMDSO top coating. RTEP1600-HMDSO, & RTEP1800-HMDSO, are thermal evaporation coating machines, which ...
Shanghai Royal Technology Inc.
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