PECVD deposition machine SPTS Osprey®

for packaging

For advanced packaging applications, the SPTS Osprey® PECVD system offers low temperature deposition processes compatible with 300mm bonded substrates and mold. Osprey® PECVD produces high quality, production qualified dielectric films at deposition temperatures as low as 110°C SiN – SiO stacks can be deposited in the same PECVD chamber with high reliability electrical performance and stability over time. Film and stack stress can be tuned across a wide range and optimized chamber hardware enables the lowest within-wafer stress range over competing PECVD systems. Where required, single-wafer and multi-wafer degas options are available to heat outgassing substrates and improve deposited film quality. Optimized SiO, TEOS SiO, SiCN and other advanced dielectric films are available for hybrid bonding and inter-die gap-fill applications. SiCN for hybrid bonding Thick SiO for inter-die gapfill Via-reveal passivation Low temperature back side films with bow compensation TSV-last liners Wafer size = 300mm Radially symmetrical gas flow for superior wafer-in-wafer (WIW) uniformity Common chamber hardware for all film types Stack deposition in a single PECVD chamber Mixed frequency plasma capability for stress tuning Active platen cooling for critical, low temperature [<175°C] packaging applications Advanced Packaging