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3D inspection machine Xceed MPcoating thicknessfor small partsPCB
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Characteristics
- Technology
- 3D
- Applications
- PCB, for small parts, coating thickness
- Sector
- for the electronics industry
- Other characteristics
- automatic, measurement, high-resolution, in-line, non-contact
Description
Product overview
Key capabilities
Inspection items and measurable attributes
Process integration
Additional notes
Caractéristiques / spécifications techniques
- Multi-Purpose 3D AOI platform designed for SMT / PCB inspection.
- Combines Component, Solder, and Conformal Coating inspection in a single machine.
- Employs a Laser Line Scan method for 3D measurement and inspection.
Key capabilities
- Multi-purpose 3D AOI enabling inspection of components, solder, solder paste, epoxy, conformal coating, and related defects.
- Component, Solder, and Conformal Coating Inspection with One Machine — unified inspection workflow without separate cycles for each inspection type.
- Laser Line Scan Method for high-precision 3D data capture.
- Foreign Material & Contamination detection; PCB warpage inspection performed without additional cycle time.
- Application software configurable according to user needs: SPI (Solder Paste Inspection) / AOI (Automated Optical Inspection) / CCI (Conformal Coating Inspection).
- Inspection items include SMD, solder paste, epoxy, conformal coating, etc.
Inspection items and measurable attributes
- Height
- Area
- Volume
- Position misalignment
- Bridge (solder bridging)
- Shape abnormalities
- PCB warpage
- PCB shrinkage / expansion (automatic compensation)
Process integration
- Supports feedback & feedforward linkage to downstream/upstream processes for process optimization.
Additional notes
- Designed to provide multiple inspection functions (SPI/AOI/CCI) via selectable application software types, enabling tailored inspection workflows to customer requirements.
Caractéristiques / spécifications techniques
- Product name: Xceed MP
- Product type: Multi-Purpose 3D AOI
- 3D capture method: Laser Line Scan
- Supported inspection modes: SPI / AOI / CCI (software selectable)
- Primary inspection targets: SMD components, solder paste, epoxy, conformal coating
- Measured parameters: height, area, volume, positional offset, bridging, shape defects
- PCB conditions handled: warpage inspection, automatic compensation for PCB shrinkage/expansion
- Process features: foreign material/contamination detection; inspection without additional cycle time; feedback & feedforward integration for process optimization
- Typical use case: unified inspection of components, solder, and conformal coating on SMT production lines
Other PARMI Europe GmbH products
SMT
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.