Optical inspection machine TR7007Q SII-S

3Dfor semiconductorssurface

Introduction
Designed for SEMI back-end, Mini-LED and 008004 paste inspection, the TR7007Q SII-S is a 25 MP 3D SEMI SPI platform with 3.5 µm top resolution. The system combines wide spectrum 2D lighting and coaxial illumination to improve defect contrast and detection rates for bumps, solder paste and Mini-LED solder inspection. The platform supports Industry 4.0 standards including IPC-CFX and IPC-HERMES-9852.

Applications

• Bumps
• Flux
• Glue
• Mini-LED solder
• Solder paste
• Surface inspection

Features

• 3.5 µm high-resolution 3D SEMI back-end and 008004 solder inspection
• Wide spectrum 2D lighting (RGB+W) and coaxial illumination for enhanced contrast
• Improved measurement accuracy and stability for precise solder height/volume assessment
• High precision inspection across multiple board-level applications
• Industry 4.0 ready: IPC-CFX and IPC-HERMES-9852 compatible
• Optional HEPA filter for clean operation

Optical System
Imaging method: Stop-and-Go imaging
Top camera: 25 Mpix
Imaging resolution: 3.5 µm (option: 6 µm)
Lighting: Wide Spectrum 2D (RGB+W) and coaxial lighting

Imaging Performance
Max. imaging speed: 2.1 FOV/sec

Motion Table & Control
X-Y-Z axis control: Ballscrew + AC servo with motion controller
X-Y-Z axis resolution: 0.1 µm

Board Handling
Max. PCB size: TR7007Q SII-S: 450 x 450 mm
TR7007Q SII-S DL: 510 x 310 mm x 2 lanes, 510 x 460 mm x 1 lane
PCB thickness: 0.6 - 5 mm
Max. PCB weight: 3 kg (optional 5 kg)
Top clearance: 25 mm
Bottom clearance: 40 mm
Edge clearance: 3 mm (optional 4 mm / 5 mm)
Conveyor inline height: 880 – 920 mm (SMEMA compatible)

Inspection Functions
Applications: bumps, flux, Mini-LED solder, solder paste
Defects detected: insufficient paste, excessive paste, shape deformity, missing paste, bridging
Measurements: height, area, volume, offset

Dimensions
WxDxH: TR7007Q SII-S: 1000 x 1480 x ~1710 mm (@15 µm resolution formatting varies)
TR7007Q SII-S DL: 1000 x 1750 x 1700 mm
Signal tower height not included (signal tower: 520 mm)
Weight: TR7007Q SII-S: 795 kg; TR7007Q SII-S DL: 840 kg

Technical specifications

• Model: TR7007Q SII-S
• Imaging resolution (top): 3.5 µm (6 µm option)
• Camera: 25 Mpix top camera
• Imaging method: Stop-and-Go imaging
• Lighting: Wide Spectrum 2D (RGB+W) + coaxial lighting
• Max imaging speed: 2.1 FOV/sec
• Motion control: Ballscrew + AC servo with motion controller
• X-Y-Z axis resolution: 0.1 µm
• Max PCB size: 450 x 450 mm (DL variants: 510 x 310 mm x2 lanes or 510 x 460 mm x1 lane)
• PCB thickness supported: 0.6 - 5 mm
• Max PCB weight: 3 kg (optional 5 kg)
• Clearances: top 25 mm; bottom 40 mm; edge 3 mm (optional 4 / 5 mm)
• Inline conveyor height: 880 - 920 mm (SMEMA compatible)
• Supported standards: IPC-CFX, IPC-HERMES-9852
• Optional: HEPA filter for clean operation