Optical inspection machine TR7700Q SII-S

3Dfor semiconductorsfor the electronics industry

INTRODUCTION
The TR7700Q SII-S is an AI-powered next-generation inspection platform for the Semiconductor & Advanced Packaging industry. It combines 3D SEMI AOI with metrology capabilities and multiple imaging technologies to deliver full-coverage inspection. The platform provides 2.5 µm resolution and can inspect wire diameters down to 15 µm. It supports Smart Factory standards including IPC-CFX and IPC-HERMES-9852.

KEY CAPABILITIES / FEATURES

• 2.5 µm high-resolution 3D SEMI back-end AOI
• Precise metrology-grade measurements (optional)
• AI-powered inspection with AI Smart Programming (optional)
• Inspection of Au, Al, Ag and Cu wires down to 15 µm
• Bond inspection: ball bond, wedge bond, ribbon bond
• Shortwave Infrared (SWIR) lighting for inner-crack and chipping detection (optional)
• Industry 4.0 / Smart Factory ready

IMAGING / OPTICAL SYSTEM
Imaging Method: Stop-and-Go Imaging
Top Camera options: 12 Mpix | 21 Mpix | 25 Mpix
Imaging resolution options: 2.5 µm / 5 µm / 5.5 µm / 7 µm / 8 µm
Lighting: Multi-phase True Color LED (SWIR optional)

IMAGING PERFORMANCE
Max. Imaging Speed:
@2.5 µm: 3.5 cm²/sec (available for TR7700Q SII-S)
@5 µm: 13 cm²/sec
@5.5 µm: 7.8 cm²/sec
@7 µm: 24 cm²/sec
@8 µm: 29 cm²/sec

MOTION TABLE & CONTROL
X Axis Control: Ballscrew + AC servo with motion controller
Y Axis Control: Dual-driven ball screw + AC servo motor
Z Axis Control: Ballscrew + AC servo with motion controller
X-Y-Z Axis Resolution: 1 µm

BOARD HANDLING
Max. PCB Size:
TR7700Q SII-S: 510 x 460 mm (at 2.5 µm: 285 x 150 mm)
TR7700Q SII-S DL: 510 x 310 mm x 2 lanes, or 510 x 590 mm x 1 lane
PCB Thickness: 0.6–5 mm
Max. PCB Weight: 3 kg (optional 5 kg)
Top Clearance: TR7700Q SII-S: 20 mm (21MP 8 µm: Top Clearance 50 mm)
Bottom Clearance: 40 mm
Edge Clearance: 3 mm (optional 4 / 5 mm)
Conveyor / Inline Height: 880–920 mm (SMEMA compatible)

INSPECTION FUNCTIONS
Component Defects

• Missing
• Tombstoning
• Billboarding
• Polarity
• Rotation
• Shift
• Wrong Marking (OCV)
• Defective / Upside Down
• Extra Component
• Foreign Material
• Lifted Component

Solder Joint Defects

• Solder Fillet Height
• Solder Volume %
• Excess Solder
• Insufficient Solder
• Bridging
• Through-hole Pins
• Lifted Lead
• Golden Finger Scratch / Contamination

Die Bonding

• Missing
• Orientation
• Shift
• Rotation
• Chipping
• Crack
• Scratch
• Foreign Material
• Epoxy on Die
• Epoxy Coverage

Wire Bonding

• Broken
• Short
• Sweep / Sink
• Missing
• Sway
• Collapse
• Loop Height
• Sagged Wire
• Cross Wire Gap
• Wire Tracing
• Ball Bond Diameter
• Ball Placement
• Stitch Width
• Stitch Coverage over Ball
• Ball-off Pad
• Ball touch Pad Distance
• Clubbed Ball
• Ball Thickness
• Lifted Ball
• Low Landing
• Bond on Contamination
• Foreign Material

BONDING AREA / PAD INSPECTION

• Copper Protrusion
• Crack
• Chipping
• Exposed Copper / Exposed Nickel
• Target Material
• Scratches or Brush Marks
• Oxidation
• Foreign Material

DIMENSIONS & WEIGHT
WxDxH:
TR7700Q SII-S: 1100 x 1720 x 1710 mm
TR7700Q SII-S DL: 1100 x 1820 x 1710 mm
Note: signal tower not included (signal tower height 515 mm)
Weight:
TR7700Q SII-S: 910 kg
TR7700Q SII-S DL: 960 kg

ADDITIONAL NOTES
Supports Smart Factory standards (IPC-CFX, IPC-HERMES-9852). Selected features are optional and noted where applicable.

TECHNICAL SPECIFICATIONS

• Model: TR7700Q SII-S
• Imaging method: Stop-and-Go Imaging
• Top camera options: 12 / 21 / 25 Mpix
• Imaging resolution options: 2.5 µm, 5 µm, 5.5 µm, 7 µm, 8 µm
• Lighting: Multi-phase True Color LED (SWIR optional)
• Max imaging speed: 3.5 cm²/sec @2.5 µm; 13 cm²/sec @5 µm; 7.8 cm²/sec @5.5 µm; 24 cm²/sec @7 µm; 29 cm²/sec @8 µm
• Motion: Ballscrew + AC Servo (X/Z), Dual-driven ball screw + AC servo (Y)
• X-Y-Z axis resolution: 1 µm
• Max PCB size: up to 510 x 460 mm (platform-dependent); 2.5 µm mode: 285 x 150 mm
• PCB thickness: 0.6–5 mm
• Max PCB weight: 3 kg (optional 5 kg)
• Top clearance: 20 mm (varies with camera configuration)
• Bottom clearance: 40 mm
• Edge clearance: 3 mm (optional 4 / 5 mm)
• Conveyor inline height: 880–920 mm (SMEMA compatible)
• Inspection targets: wire bonding, die bonding, ball bonding, ribbon bond, wedge bond, SiP, underfill, SMD, bumps, solder joints